Laser Assisted Selective Metallization of Polymers-Reference-Cited by-同舟云学术

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Laser Assisted Selective Metallization of Polymers

Published:2018-09 Issue: Volume: Page:
ISSN:
Container-title:2018 13th International Congress Molded Interconnect Devices (MID)
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Author:

Ratautas Karolis,Jagminiene Aldona,Stankeviciene Ina,Norkus Eugenijus,Raciukaitis Gediminas

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8511013/8526928/08526970.pdf?arnumber=8526970

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Laser Direct Structuring (LDS) for enhanced QFN package;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

2. UV Laser Copper Pad Surface Exposure for Laser Direct Structuring (LDS) of Interconnection;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11

3. Study for implementation of electronic circuits into multifunctional miniaturized thermoplastic enclosures;2023 15th International Congress Mechatronic Integration Discourse (MID);2023-06-21

4. Fabrication of Electrically Conductive Patterns on Acrylonitrile-Butadiene-Styrene Polymer Using Low-Pressure Cold Spray and Electroless Plating;Journal of Micro and Nano-Manufacturing;2020-12-01

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