Three-dimensional Simulation of Effects of Electro-Thermo-Mechanical Multi-physical Fields on Cu Protrusion and Performance of Micro-bump Joints in TSVs Based High Bandwidth Memory (HBM) Structures
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Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159369.pdf?arnumber=9159369
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