Author:
Lall Pradeep,Zhang Yunli,Kasturi Madhu,Wu Haotian,Davis Edward,Suhling Jeff
Cited by
18 articles.
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1. Fatigue-Fracture Propensity Measurement and Competing Risk Model for FCBGA Interfaces under Sustained Humidity and Temperature Exposure;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Research on the Latch-Up Mechanism of DSOI at High Temperature;2024 IEEE International Reliability Physics Symposium (IRPS);2024-04-14
3. Assessment of Competing Risk-of-Failure in FCBGA Interfaces Operating in Harsh Automotive Underhood Environments for Periods up to 1-Year;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
4. Chip-Underfill Interface Damage Model Under Fatigue Loading after Sustained High-Temperature Exposure;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
5. Characterization of Aging Effects on Thermal and Mechanical Properties of Magnetically-Oriented ACA for Flexible and Stretchable Electronics;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30