Growth kinetics of intermetallic compound layers at the interface during laser-assisted bonding depending on surface finish
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Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159282.pdf?arnumber=9159282
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni-Less Surface Finish via Laser-Assisted Bonding;Materials;2024-07-22
2. Comparative study on the bonding property of laser and reflow soldered Sn-3.0Ag-0.5Cu/Ni–P microbumps after isothermal aging and multiple reflowing;Journal of Materials Research and Technology;2024-03
3. Comparative study of laser- and reflow-soldered Sn–3.0Ag–0.5Cu joints on thin Au/Pd/Ni(P) substrate;Journal of Materials Science: Materials in Electronics;2023-01
4. Comparative study of interfacial reaction and bonding property of laser- and reflow-soldered Sn–Ag–Cu/Cu joints;Journal of Materials Science: Materials in Electronics;2022-02-26
5. Microstructural evolution and mechanical properties of SAC305 with the intense pulsed light soldering process under high-temperature storage test;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06
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