Pressureless Sintering Process of Ag Sinter Paste Bonding Ag Si Die on Bare Cu DBC Using Convection Reflow Oven in Nitrogen for Die Attach
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Publisher
IEEE
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http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159229.pdf?arnumber=9159229
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Bare copper bonding with facilely synthesized Ag nanoparticles decorated Cu microparticles paste;Journal of Materials Science: Materials in Electronics;2024-08
2. Analysis and Modeling of Electrothermal Characteristics of SiC Power Module Based on Planar Interconnection;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
3. New Ag pastes siter joining on Ag and Cu surface for high temperature application;2021 International Conference on Electronics Packaging (ICEP);2021-05-12
4. Ultra-Thin Glass Based Temperature Sensor Package for High Temperature Applications;2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC);2020-09-15
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