Electro-migration evaluation between organic interposer and build-up substrate on 2.3D organic package-Reference-Cited by-同舟云学术

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Electro-migration evaluation between organic interposer and build-up substrate on 2.3D organic package

Published:2020-06 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
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Author:

Murayama Kei,Miki Shota,Sugahara Hiromi,Oi Kiyoshi

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159448.pdf?arnumber=9159448

Cited by 27 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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