Author:
Sierra Suarez Jonatan A.,Mudrick John P.,Sennett Crystal C.,Friedmann T.A.,Arterburn Shawn,Jordan Matthew B.,Caravello Lisa,Gutierrez Jordan E.,David Henry M.
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1 articles.
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1. Thermal Finite Element Simulation of Ultrafine Pitch Chip-to-Wafer Hybrid Bonding;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08