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EMI-Related Common-Mode (CM) Noise Analysis and Prediction of High-Speed Source-Series Terminated (SST) I/O Driver in System-on-Package (SOP)

  • Published:2018-04 Issue:4 Volume:65 Page:446-450
  • ISSN:1549-7747
  • Container-title:IEEE Transactions on Circuits and Systems II: Express Briefs
  • language:
  • Short-container-title:IEEE Trans. Circuits Syst. II

Author:

Maqbool Khawaja QasimORCID,Luo Duona,Luo Xingyun,Yu Huichun,Yue Chik Patrick

Funder

Research Grants Council of Hong Kong SAR Government, China

Huawei, Shenzhen, China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Quantitative Analysis and Prediction of EMI From Spread Spectrum of Differential Random Signaling Based on IC Source Modeling;IEEE Transactions on Electromagnetic Compatibility;2024

2. A DAC-Based 28Gb/s PAM4 Transmitter for Serial Link System;2023 8th International Conference on Integrated Circuits and Microsystems (ICICM);2023-10-20

3. Prediction and Analysis of Radiated EMI From a Wafer-Level Package Based on IC Source Modeling;IEEE Transactions on Electromagnetic Compatibility;2023

4. Sensing and Cancellation Circuits for Mitigating EMI-Related Common Mode Noise in High-Speed PAM-4 Transmitter;IEEE Transactions on Circuits and Systems I: Regular Papers;2021-11

5. DM Interference Propagation Mathematical Modeling in SiC Wirebond Multichip Power Module;IEEE Transactions on Circuits and Systems II: Express Briefs;2021-06
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