FEM-based thermal analysis of IGBT-Reference-Cited by-同舟云学术

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FEM-based thermal analysis of IGBT

Published:2010-09 Issue: Volume: Page:
ISSN:
Container-title:2010 Asia Pacific Conference on Postgraduate Research in Microelectronics and Electronics (PrimeAsia)
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Author:

Zhang Jian,Lu Changzhi,Zhang Xiaoling,Huang Yueqiang,Meng Xianlei

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5599081/5604871/05604896.pdf?arnumber=5604896

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal Analysis and Comparative Study of Power Conversion System Main Topology Using SiC MOSFETs;2023 IEEE International Conference on Advanced Power System Automation and Protection (APAP);2023-10-08

2. Geometry Optimization for Increasing Fatigue Life of Pressing Packaged IGBT with SiC Chips and Silver Sintering Layers;Journal of Physics: Conference Series;2022-12-01

3. Solar powered electric vehicle using maximum power point tracking;Material Science & Engineering International Journal;2022-10-11

4. A Thermal Model of an IGBT Module Taking into Account Thermal Interconnections between Chips;Russian Electrical Engineering;2019-01

5. A Real-Time Thermal Model for Monitoring of Power Semiconductor Devices;IEEE Transactions on Industry Applications;2015-07

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