Integration And HCI Improvement In Deep Sub-Micro CMOS process
Author:
Affiliation:
1. Technology Development Central Semiconductor Manufacturing Corporation (CSMC),Wuxi,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10221568/10221569/10221570.pdf?arnumber=10221570
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3. Oxide reliability of drain engineered I/O NMOS from hot carrier injection
4. Voltage Ramp Stress for Hot-Carrier Screening of Scaled CMOS Devices
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