Modeling of eye diagram height in high-speed links via support vector machine-Reference-Cited by-同舟云学术

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Modeling of eye diagram height in high-speed links via support vector machine

Published:2018-05 Issue: Volume: Page:
ISSN:
Container-title:2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI)
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Author:

Trinchero R.,Canavero F. G.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8394764/8401641/08401679.pdf?arnumber=8401679

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Predicting the Characteristics of High-Speed Serial Links Based on a Deep Neural Network (DNN)—Transformer Cascaded Model;Electronics;2024-08-02

2. High-Speed Receiver Transient Modeling with Generative Adversarial Networks;2024 IEEE 33rd Microelectronics Design & Test Symposium (MDTS);2024-05-13

3. Stochastic Time-Domain Mapping for Comprehensive Uncertainty Assessment in Eye Diagrams;IEEE Transactions on Electromagnetic Compatibility;2023-12

4. AI-Enhanced Modal Decomposition Method for Fast and Efficient PCB Modeling and Signal Integrity;2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC);2023-10-20

5. Surrogate Modeling of High-Speed Links Based on GNN and RNN for Signal Integrity Applications;IEEE Transactions on Microwave Theory and Techniques;2023-09

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