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Benefit Model of Virtual Metrology and Integrating AVM Into MES

  • Published:2011-05 Issue:2 Volume:24 Page:261-272
  • ISSN:0894-6507
  • Container-title:IEEE Transactions on Semiconductor Manufacturing
  • language:
  • Short-container-title:IEEE Trans. Semicond. Manufact.

Author:

Cheng Fan-Tien,Chang Jonathan Yung-Cheng,Huang Hsien-Cheng,Kao Chi-An,Chen Ying-Lin,Peng Ju-Lei

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Cited by 30 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Convolutional neural network based multi-input multi-output model for multi-sensor multivariate virtual metrology in semiconductor manufacturing;Annals of Operations Research;2024-03-16

2. Virtual metrology for enabling zero-defect manufacturing: a review and prospects;The International Journal of Advanced Manufacturing Technology;2024-01-09

3. Causality-based Prediction Method for the Diesel Engine Assembly Line System;2022 IEEE 18th International Conference on Automation Science and Engineering (CASE);2022-08-20

4. The role of big data analytics in the context of modeling design and operation of manufacturing systems;Design and Operation of Production Networks for Mass Personalization in the Era of Cloud Technology;2022

5. Virtual metrology as an approach for product quality estimation in Industry 4.0: a systematic review and integrative conceptual framework;International Journal of Production Research;2021-09-21
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