Advancements in IC Technologies: A look toward the future-Reference-Cited by-同舟云学术

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Advancements in IC Technologies: A look toward the future

Published:2023 Issue:3 Volume:15 Page:80-86
ISSN:1943-0582
Container-title:IEEE Solid-State Circuits Magazine
language:
Short-container-title:IEEE Solid-State Circuits Mag.

Author:

Collaert Nadine¹^ORCID

Affiliation:

1. Imec, Heverlee, Belgium

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/4563670/10224560/10224630.pdf?arnumber=10224630

Reference17 articles.

1. Lakefield: Hybrid cores in 3D Package

2. Heterogeneous system partitioning and the 3D interconnect technology landscape;beyne;Proc Symp VLSI Technol Circuits Short Course SC2-2,0

3. DTCO including Sustainability: Power-Performance-Area-Cost-Environmental score (PPACE) Analysis for Logic Technologies

4. The 3-D Interconnect Technology Landscape

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Design and investigation of computation-in-memory based low power hybrid MTJ/CMOS logic gates;Cogent Engineering;2024-05

2. Design and Assessment of Hybrid MTJ/CMOS Circuits for In-Memory-Computation;Journal of Low Power Electronics and Applications;2024-01-06

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