Author:
Hejase Jose A.,Chun Sungjun,Becker Wiren D.,Dreps Daniel M.,Beaman Brian S.
Cited by
2 articles.
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1. A Study of Signal Integrity on Hybrid Land Grid Array Socket Connector;2023 Joint Asia-Pacific International Symposium on Electromagnetic Compatibility and International Conference on ElectroMagnetic Interference & Compatibility (APEMC/INCEMIC);2023-05-23
2. Structural Design of Land Grid Array Loading Mechanisms for Intel Central Processor Unit Stack Retention;Journal of Electronic Packaging;2019-02-25