High-speed performance of Silicon Bridge die-to-die interconnects-Reference-Cited by-同舟云学术

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High-speed performance of Silicon Bridge die-to-die interconnects

Published:2011-10 Issue: Volume: Page:
ISSN:
Container-title:2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems
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Author:

Braunisch Henning,Aleksov Aleksandar,Lotz Stefanie,Swan Johanna

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6088024/6100155/06100196.pdf?arnumber=6100196

Cited by 17 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Glass and Glass/LTCC Interposers as Heterogenous Integration Platform;2024 Pan Pacific Strategic Electronics Symposium (Pan Pacific);2024-01-29

2. Floorplanning for Embedded Multi-Die Interconnect Bridge Packages;2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD);2023-10-28

3. Using Chiplet Encapsulation Technology to Achieve Processing-in-Memory Functions;Micromachines;2022-10-20

4. From 2.5D to 3D Chiplet Systems: Investigation of Thermal Implications with HotSpot 7.0;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31

5. A Fast-Lock All-Digital Clock Generator for Energy Efficient Chiplet-Based Systems;IEEE Access;2022

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