Hybrid Vapor Chamber-based Cooling System for Power Electronics-Reference-Cited by-同舟云学术

Hybrid Vapor Chamber-based Cooling System for Power Electronics

Published:2022-05-31 Issue: Volume: Page:
ISSN:
Container-title:2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
language:
Short-container-title:

Author:

Damoulakis George¹,Bao Congbo²,Gukeh Mohamad Jafari¹,Mukhopadhyay Arani²,Mazumder Sudip K.¹,Megaridis Constantine M.¹

Affiliation:

1. University of Illinois at Chicago,Mechanical and Industrial Engineering,Chicago,IL,USA

2. University of Illinois at Chicago,Electrical and Computer Engineering,Chicago,IL,USA

Funder

Office of Naval Research

Publisher

IEEE

Link

Reference15 articles.

1. High-performance Planar Thermal Diode with Wickless Components;damoulakis;Journal of Electronic Packaging,2021

3. Wick-Free Paradigm for High-Performance Vapor-Chamber Heat Spreaders;damoulakis;Energy Conversation and Management,2021

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Evaluation of Thermal Performance of a Wick-free Vapor Chamber in Power Electronics Cooling;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30

2. Thermal Performance of a Liquid-cooling Assisted Thin Wickless Vapor Chamber;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30