Size Determination of Voids in the Soldering of Automotive DC/DC-Converters via IR Thermography-Reference-Cited by-同舟云学术

Size Determination of Voids in the Soldering of Automotive DC/DC-Converters via IR Thermography

Published:2022-05-31 Issue: Volume: Page:
ISSN:
Container-title:2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
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Author:

Jahn Nils¹,Pfost Martin¹

Affiliation:

1. TU Dortmund University,Chair of Energy Conversion,Dortmund,Germany

Funder

Ministry of Education

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9899435/9899496/09899529.pdf?arnumber=9899529

Reference8 articles.

1. Solder Defect Detection for Power Semiconductors by Adjacent Temperature Monitors

2. How to evaluate transient dual interface measurements of the Rth-JC of power semiconductor packages

3. Thermographic inspection method for quality assessment of power semiconductors in the manufacture of power electronics modules

4. Using infrared thermal responses for PCBA production tests: feasibility study;el belghiti alaoui;the 7th European Symposium on Reliability of Electron Devices Failure Physics and Analysis,2019

5. Thermal impact of solder voids in the electronic packaging of power devices

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1. Thermal Onboard Detection of Voids in the Solder Layer Between Power Semiconductor and PCB;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-08

2. Detection of Bond Wire Failure in Power Semiconductors by Adjacent Temperature Sensors;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

3. Void Detection in the Solder Layer between Power Semiconductor and PCB;2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2022-09-28