Multi-Path Routing in Green Multi-Stage Upgrade for Bundled-Links SDN/OSPF-ECMP Networks-Reference-Cited by-同舟云学术

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Multi-Path Routing in Green Multi-Stage Upgrade for Bundled-Links SDN/OSPF-ECMP Networks

Published:2021 Issue: Volume:9 Page:99073-99091
ISSN:2169-3536
Container-title:IEEE Access
language:
Short-container-title:IEEE Access

Author:

Hiryanto Lely,Soh Sieteng,Chin Kwan-Wu,Pham Duc-Son,Lazarescu Mihai M.

Funder

Australian Government through the Department of Foreign Affairs and Trade

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering,General Materials Science,General Computer Science

Link

http://xplorestaging.ieee.org/ielx7/6287639/9312710/09469918.pdf?arnumber=9469918

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Way to Implement Network Services in a Data Center;2024 Wave Electronics and its Application in Information and Telecommunication Systems (WECONF);2024-06-03

2. Metaheuristic based segment routing for hybrid software-defined network under heterogeneous environment;International Journal of Communication Networks and Distributed Systems;2024

3. ANN-Assisted Scheduling Method for Bulk Data Transfers in Optical Computing Power Networks;2023 Opto-Electronics and Communications Conference (OECC);2023-07-02

4. SDN ‐based load balance routing mechanism for Information Centric Networking;Internet Technology Letters;2022-05-22

5. Green Multistage Upgrade of Switches and Controllers for Bundled-Links SDNs;IEEE Access;2022

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