Modeling of Insulation Paper Damage in the Assembly of a Solid Slot Winding-Reference-Cited by-同舟云学术

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Modeling of Insulation Paper Damage in the Assembly of a Solid Slot Winding

Published:2020 Issue: Volume:8 Page:27831-27850
ISSN:2169-3536
Container-title:IEEE Access
language:
Short-container-title:IEEE Access

Author:

Stefe Blaz,Jenko Marjan^ORCID

Funder

Horizon 2020 Framework Programme

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering,General Materials Science,General Computer Science

Link

http://xplorestaging.ieee.org/ielx7/6287639/8948470/08984326.pdf?arnumber=8984326

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. KH550‐SiO₂/polyimide insulating paper preparation and characterisation;High Voltage;2023-08-25

3. KH560-SiO2/PI Insulating Paper Preparation and Characterisation;2023 IEEE 4th International Conference on Electrical Materials and Power Equipment (ICEMPE);2023-05-07

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