Thermal Cycling Reliability of Lead-Free Solder Alloys using Surface Mount Resistors Considering Aging-Reference-Cited by-同舟云学术

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Thermal Cycling Reliability of Lead-Free Solder Alloys using Surface Mount Resistors Considering Aging

Published:2021-06-01 Issue: Volume: Page:
ISSN:
Container-title:2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
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Author:

Akkara Francy John,Abueed Mohammed,Srinivasan Arvind,Belhadi Mohammed,Vyas Palash,Hamasha Sa'D,Suhling Jeff,Lall Pradeep

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9502930/9503122/09503190.pdf?arnumber=9503190

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Drop Shock Performance of SAC-Bi Compared to SnPb;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31

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