Author:
Mondal Debabrata,Wu Jing,Fahim Abdullah,Suhling Jeffrey C.,Lall Pradeep
Cited by
2 articles.
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1. Indentation Creep Properties Evolution of Lead-Free Solder Joints Subjected to Thermal Cycling;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31
2. A Crystal Plasticity Finite Element Modeling to Explain the Effects of β-Sn Crystal Orientation on SAC305 Solder Ball Deformation;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31