Low Temperature Solder Interconnection of Surface Mount Devices with Additively Printed Pads on Flexible Substrate
Author:
Funder
Manufacturing Institute
Air Force Research Laboratory
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9502930/9503122/09503253.pdf?arnumber=9503253
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Photonic curing and soldering to printed silver for enhanced attachment and joint quality;2024 International Conference on Electronics Packaging (ICEP);2024-04-17
2. Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistors;Journal of Electronic Materials;2023-03-25
3. Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization;Journal of Electronic Packaging;2022-11-23
4. Component Attachment to Inkjet Additive Printed Circuits to Achieve Flexible Signal Filters using Silver and Copper Nanoparticle Metal Inks;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31
5. Prediction of Electrical Performance and Print Geometry for Inkjet Additive Circuits via Statistical Modeling;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31
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