Segmented Thermal Management with Flash Cooling for Heterogeneous Wafer-Scale Systems-Reference-Cited by-同舟云学术

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Segmented Thermal Management with Flash Cooling for Heterogeneous Wafer-Scale Systems

Published:2021-06-01 Issue: Volume: Page:
ISSN:
Container-title:2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
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Author:

Shah Ujash,Iyer Subramanian S.,Fisher Timothy S.

Funder

Advanced Research Projects Agency

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9502930/9503122/09503210.pdf?arnumber=9503210

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. TSV-less Power Delivery for Wafer-scale Assemblies and Interposers;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

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