Field Grading Composites Tailored by Electrophoresis—Part 3: Application to Power Electronics Modules Encapsulation-Reference-Cited by-同舟云学术

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Field Grading Composites Tailored by Electrophoresis—Part 3: Application to Power Electronics Modules Encapsulation

Published:2021-04 Issue:2 Volume:28 Page:348-354
ISSN:1070-9878
Container-title:IEEE Transactions on Dielectrics and Electrical Insulation
language:
Short-container-title:IEEE Trans. Dielect. Electr. Insul.

Author:

Diaham S.,Valdez-Nava Z.,Le T. T.,Leveque L.,Laudebat L.,Lebey T.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/94/9405728/09405773.pdf?arnumber=9405773

Cited by 31 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Self-Adaptive Field-Grading Coating for Partial Discharge Mitigation of High Voltage Power Module Under High dv/dt Square Wave Voltage;IEEE Transactions on Power Electronics;2024-08

2. A Review of Partial Discharge in Medium Voltage SiC Power Modules Under Square Wave Excitation: Characterization, Mitigation, and Detection;IEEE Journal of Emerging and Selected Topics in Power Electronics;2024-08

3. Application and Benefit Analysis of Guard Ring Methods in Reducing the Maximum Electric Field of Half Bridge Power Module;2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia);2024-05-17

4. Effect of interdiffusion layer of functionally graded Al–Cu composites fabricated by spark plasma sintering on mechanical and thermal properties;Journal of Materials Research and Technology;2024-05

5. Methods for increasing the Partial Discharge Inception Voltage of Power Module Substrates using Guard Ring Structures;2024 IEEE Applied Power Electronics Conference and Exposition (APEC);2024-02-25

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