Impact of Defect Structures on Interfacial and Insulation Properties in Epoxy-Impregnated Aramid Paper-Reference-Cited by-同舟云学术

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Impact of Defect Structures on Interfacial and Insulation Properties in Epoxy-Impregnated Aramid Paper

Published:2024-08 Issue:4 Volume:31 Page:1815-1822
ISSN:1070-9878
Container-title:IEEE Transactions on Dielectrics and Electrical Insulation
language:
Short-container-title:IEEE Trans. Dielect. Electr. Insul.

Author:

Ruan Hao-ou¹^ORCID,Hu Shi-xun²,Song Jing-xuan³^ORCID,Liu Xiong⁴

Affiliation:

1. Faculty of Engineering, University of Tokyo, Tokyo, Japan

2. Department of Electrical Engineering, Tsinghua University, Beijing, China

3. School of Electrical and Electronic Engineering, North China Electric Power University, Beijing, China

4. Chongqing Electric Power Research Institute, State Grid Chongqing Electric Power Company, Chongqing, China

Funder

Japan Society for the Promotion of Science (JSPS) International Research Fellowships

State Grid Technology Project

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/94/10623348/10480621.pdf?arnumber=10480621

Reference26 articles.

1. A Promising De-Ionized Water Cooling Based ERIP Bushing-I: Model Validation and High Cooling Efficiency of the Cooling Method

2. Effect of Aging Time on the Growth Characteristics of Electrical Treeing in Epoxy Resin-Impregnated Paper

3. Influence of material volume conductivity on electric field and surface charge of RIP valve-side bushing core under DC electro-thermal coupling stress

4. Mechanism of improvement in the strength of para-aramid paper by polyphenylene sulfide pulp

5. Dielectric response and space charge in epoxy impregnated paper composite laminates

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Interface engineering via non-thermal atmospheric plasma for highly tensile insulating epoxy-impregnated aramid composite paper;Composites Science and Technology;2024-10

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