Probing the Band Alignment at the Au/Polymer Interface-Reference-Cited by-同舟云学术

Probing the Band Alignment at the Au/Polymer Interface

Published:2023-12 Issue:6 Volume:30 Page:2923-2925
ISSN:1070-9878
Container-title:IEEE Transactions on Dielectrics and Electrical Insulation
language:
Short-container-title:IEEE Trans. Dielect. Electr. Insul.

Author:

Katase D.¹^ORCID,Suzuki H.¹^ORCID,Kobayashi M.²^ORCID,Kumada A.¹^ORCID,Sato M.¹^ORCID

Affiliation:

1. Department of Electrical Engineering and Information Systems, The University of Tokyo, Bunkyo-ku, Japan

2. Department of Electrical Engineering and Information Systems and the Center for Spintronics Research Network, The University of Tokyo, Bunkyo-ku, Japan

Funder

Mizuho Foundation for the Promotion of Sciences

Yashima Environment Technology Foundation

Research Foundation for the Electrotechnology of Chubu

TEPCO Memorial Foundation

Spintronics Research Network of Japan

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/94/10375119/10309211.pdf?arnumber=10309211

Reference20 articles.

1. Electrical Degradation and Breakdown in Polymers

2. Thermionic Emission, Field Emission, and the Transition Region

3. Charge injection and recombination at the metal–organic interface

4. Atomistic Modeling of Charge Injection Into Dielectric Polymers

5. First-principles studies of carrier injection in polyethylene (PE) and ethylene-vinyl acetate copolymer (EVA) oligomers

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