Image Processing Methods for Detecting Voids in the Solder Joints of Surface-Mounted Components-Reference-Cited by-同舟云学术

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Image Processing Methods for Detecting Voids in the Solder Joints of Surface-Mounted Components

Published:2022-05-11 Issue: Volume: Page:
ISSN:
Container-title:2022 45th International Spring Seminar on Electronics Technology (ISSE)
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Author:

Krammer Oliver¹,Varga Arpad²,Geczy Attila¹,Csorba Kristof²

Affiliation:

1. Budapest University of Technology and Economics,Faculty of Electrical Engineering and Informatics,Department of Electronics Technology,Budapest,Hungary

2. Budapest University of Technology and Economics,Faculty of Electrical Engineering and Informatics,Department of Automation and Applied Informatics,Budapest,Hungary

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9812704/9812706/09812775.pdf?arnumber=9812775

Reference9 articles.

1. Surface tension and density of binary lead and lead-free Sn-based solders

2. Numerical study of the gas flow velocity space in convection reflow oven

3. Imaging and Analysis of Void-Defects in Solder Joints Formed in Reduced Gravity Using High-Resolution Computed Tomography

4. Relationship of Soldering Profile, Voids Formation and Strength of Soldered Joints

5. Robust automated void detection in solder balls and joints;said;IPC APEX EXPO Conference,2010

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