Influence of PCB Surface Finishes on Intermetallic Compound Growth
Author:
Affiliation:
1. University of West Bohemia,Research and Innovation Centre for Electrical Engineering, Faculty of Electrical Engineering,Department of Materials and Technology,Pilsen,Czech Republic
Funder
Ministry of Education
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9812704/9812706/09812788.pdf?arnumber=9812788
Reference7 articles.
1. Materials modification of the lead-free solders incorporated with micro/nano-sized particles: A review
2. A review of lead-free solders for electronics applications
3. Interfacial microstructure and mechanical properties of laser-welded 6061Al/AISI304 dissimilar lap joints via beam oscillation
4. Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging
5. Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging
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