Research on the Influence of Bond Wire Lift-Off Position on the Electro-Thermal Characteristics of IGBT-Reference-Cited by-同舟云学术

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Research on the Influence of Bond Wire Lift-Off Position on the Electro-Thermal Characteristics of IGBT

Published:2022-03 Issue:3 Volume:69 Page:1271-1278
ISSN:0018-9383
Container-title:IEEE Transactions on Electron Devices
language:
Short-container-title:IEEE Trans. Electron Devices

Author:

Tu Chunming¹,Xu Haoliang¹^ORCID,Xiao Biao¹,Lu Jiwu¹^ORCID,Guo Qi¹^ORCID,Long Liu¹

Affiliation:

1. College of Electrical and Information Engineering, Hunan University, Changsha, China

Funder

National Key Research and Development Project

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/16/9722602/09684029.pdf?arnumber=9684029

Reference30 articles.

1. Research of insulated gate bipolar transistor junction temperature measurement;mao,2013

2. Research on failures of bonding wire in IGBTs module;zhou;Journal of Power Supply,2016

3. Study of IGBT module aging failure base on bond wire equivalent resistance;peng;Trans China Electrotechn Soc,2017

4. A quasi-online method monitoring healthy state of bond wires in IGBTs based on module transconductance;li;Proc CSEE,7137

5. Research on condition monitoring for defects inside IGBT modules based on voltage drop of bond wires;gong;Journal of Power Supply,2016

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Multiphysics Coupling in IGBT Modules: A Review;Journal of Electronic Packaging;2024-07-26

2. Research on the Electro-Thermal–Mechanical Properties of IGBT Modules Under Different Bond Wire Failure Modes;IEEE Transactions on Electron Devices;2024-07

3. Enhancing the Resilience of Medical Equipment with Innovative IGBT Protection Strategies in Modern Smart Grid Ecosystems;2024 9th Asia Conference on Power and Electrical Engineering (ACPEE);2024-04-11

4. An Online Monitoring Method for Bond Wire Fatigue in IGBT Module;IEEE Journal of the Electron Devices Society;2024

5. Bond wires aging monitoring for IGBT module based on junction temperature difference of TSEPs;IEICE Electronics Express;2023-11-10

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