Affiliation:
1. Department of Mechanical and Aerospace Engineering, The Hong Kong University of Science and Technology, Sai Kung, Hong Kong, SAR
2. College of Electronics and Information Engineering, Shenzhen University, Shenzhen, China
Funder
Hong Kong Research Grants Council
Shenzhen Science and Technology Commission
Hong Kong Innovation and Technology Fund (ITF) through the Hong Kong University of Science and Technology–Massachusetts Institute of Technology (HKUST-MIT) Research Consortium Alliance
National Natural Science Foundation (NSCF) of China
NSF Guangdong Province
High-Talent Research Funding
Fundamental Research Foundation of Shenzhen
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
5 articles.
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