Optimal core wrapper width selection and SOC test scheduling based on 3-D bin packing algorithm

Author:

Yu Huang ,Reddy S.M.,Wu-Tung Cheng ,Reuter P.,Mukherjee N.,Chien-Chung Tsai ,Samman O.,Zaidan Y.

Publisher

IEEE

Cited by 77 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Study on Minimum Annual Electricity Bill of a Campus Microgrid Using the Sparrow Search Algorithm and Bin Packing Method;2023 9th International Conference on Control, Decision and Information Technologies (CoDIT);2023-07-03

2. Power-aware partitioning and test time reduction for 3D-SoC;Innovations in Systems and Software Engineering;2022-09-06

3. A TSV Constrained Algorithm for Designing Balanced Wrapper Chains in 3D SoC;Lecture Notes in Networks and Systems;2021-11-03

4. Designing balanced wrapper chains in 3D SoC under constrained TSVs;Innovations in Systems and Software Engineering;2021-05-25

5. Test Time Reduction of 3-D Stacked ICs Using Ternary Coded Simultaneous Bidirectional Signaling in Parallel Test Ports;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2020-12

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