Author:
Marinissen E.J.,Goel S.K.,Lousberg M.
Cited by
125 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. On Managing Test-Time, Power, and Layer Assignment in 3D SoCs with Built-In-Self-Repair Modules;2024 37th International Conference on VLSI Design and 2024 23rd International Conference on Embedded Systems (VLSID);2024-01-06
2. Signal Agnostic Scalable Scan Wrapper Design;2023 36th International Conference on VLSI Design and 2023 22nd International Conference on Embedded Systems (VLSID);2023-01
3. Frequency-scaled thermal-aware test scheduling for 3D ICs using machine learning based temperature estimation;Microelectronics Journal;2022-10
4. Power-aware partitioning and test time reduction for 3D-SoC;Innovations in Systems and Software Engineering;2022-09-06
5. Enhancing At-Speed Testability of Complex Inter-Core IO Interfaces;2022 IEEE International Test Conference India (ITC India);2022-07-24