Thermal printer-Reference-Cited by-同舟云学术

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Thermal printer

Published:1973-02 Issue:1 Volume:8 Page:71-78
ISSN:0018-9200
Container-title:IEEE Journal of Solid-State Circuits
language:
Short-container-title:IEEE J. Solid-State Circuits

Author:

Payne T.R.,Plumlee H.R.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/4/22528/01050348.pdf?arnumber=1050348

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Improvement of diamond adhesion to TaN2 electrical-resistance materials;Materials Letters;1996-10

2. Diamond nucleation and growth on TaN2;Journal of Applied Physics;1995-12-15

3. Combining Patterned Self‐Assembled Monolayers of Alkanethiolates on Gold with Anisotropic Etching of Silicon to Generate Controlled Surface Morphologies;Journal of The Electrochemical Society;1995-02-01

4. Thermal Printing;Output Hardcopy Devices;1988

5. Schreibmaschinen, Druckwerke, Kopierer;Peripherie von Informationssystemen;1987

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