Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Cited by
93 articles.
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1. Redundancy Analysis Simplification Scheme for High-Speed Memory Repair;2023 20th International SoC Design Conference (ISOCC);2023-10-25
2. RA-Aware Fail Data Collection Architecture for Cost Reduction;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2023
3. A New Fail Address Memory Architecture for Cost-Effective ATE;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2023
4. FAME: Fault Address Memory Structure for Repair Time Reduction;2022 19th International SoC Design Conference (ISOCC);2022-10-19
5. Multi-Bank Optimized Redundancy Analysis Using Efficient Fault Collection;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2021