The Design and Fabrication of the High Integrated Sensitive Electrodes by Adopting the Anodic Bonding Technology for the Electrochemical Seismic Sensors-Reference-Cited by-同舟云学术

The Design and Fabrication of the High Integrated Sensitive Electrodes by Adopting the Anodic Bonding Technology for the Electrochemical Seismic Sensors

Published:2021-01-25 Issue: Volume: Page:
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Container-title:2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS)
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Author:

Xu Chao,Wang Junbo,Chen Deyong,Chen Jian,Qi Wenjie,Liu Bowen,She Xu,Liang Tian

Funder

Research and Development

Chinese Academy of Sciences

National Science Fund for Distinguished Young Scholars

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9375130/9375148/09375375.pdf?arnumber=9375375

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