Author:
Yasukawa A.,Kitano M.,Sakamoto T.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
3 articles.
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1. Closed-Form Solution for Thermo-Elastoplastic Strains in Semiconductor Chip Bonding Structures;JSME international journal. Ser. A, Mechanics and material engineering;1993-10-15
2. Packaging and interconnection of sensors;Sensors and Actuators A: Physical;1990-10
3. A new index S for evaluating solder joint thermal fatigue strength;IEEE Transactions on Components, Hybrids, and Manufacturing Technology;1990