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A Novel Copper Layer-Based Field-to-Trace Coupling Model and EMS Evaluation Method for DSP-Based Control Circuit in MMC-HVDC System

  • Published:2021-02 Issue:1 Volume:9 Page:1133-1146
  • ISSN:2168-6777
  • Container-title:IEEE Journal of Emerging and Selected Topics in Power Electronics
  • language:
  • Short-container-title:IEEE J. Emerg. Sel. Topics Power Electron.

Author:

Tian YidongORCID,Yang XuORCID,Chen WenjieORCID

Funder

National Natural Science Foundation of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Energy Engineering and Power Technology

Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Fast EMI Model Based on Equivalent Interference Sources in Medium-Voltage Cascaded H-Bridge System;IEEE Transactions on Electromagnetic Compatibility;2024-08

2. A Comprehensive Analysis of EMI Magnetic Shielding Approaches for Power Module;2024 Tenth International Conference on Communications and Electronics (ICCE);2024-07-31

3. Modeling and Evaluation of Common-Mode EMI Coupling Through Converter Chassis in Metro Traction System;IEEE Transactions on Electromagnetic Compatibility;2023-12

4. A Cascaded Dual Four-Leg Inverter for Photovoltaic Systems With Capability to Compensate Unbalanced Distribution Networks;IEEE Journal of Emerging and Selected Topics in Industrial Electronics;2023-07

5. Submodule Switching-State Based EMI Modeling and Mixed-Mode EMI Phenomenon in MMC;IEEE Transactions on Power Electronics;2023-02
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