Fabrication of Etched Facets and Vertical Couplers in InP for Packaging and On-Wafer Test
Author:
Affiliation:
1. COBRA Research Institute, Eindhoven University of Technology, Eindhoven, The Netherlands
2. Fraunhofer-Institut für Nachrichtentechnik Heinrich-Hertz-Institut, Berlin, Germany
Funder
carried out in the ProCon Project
Dutch Technology Foundation STW, which is part of the Netherlands Organization for Scientific Research
Dutch Ministry of Economic Affairs
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/68/7360965/07302561.pdf?arnumber=7302561
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