Packaging and modular assembly of large-area and fine-pitch 2-D ultrasonic transducer arrays-Reference-Cited by-同舟云学术

Packaging and modular assembly of large-area and fine-pitch 2-D ultrasonic transducer arrays

Published:2013-07 Issue:7 Volume:60 Page:1356-1375
ISSN:0885-3010
Container-title:IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
language:
Short-container-title:IEEE Trans. Ultrason., Ferroelect., Freq. Contr.

Author:

Lin Der-Song¹,Wodnicki Robert²,Zhuang Xuefeng³,Woychik Charles⁴,Thomenius Kai E.²,Fisher Rayette A.²,Mills David M.⁵,Byun Albert J.²,Burdick William²,Khuri-Yakub Pierre³,Bonitz Barry⁶,Davies Todd⁶,Thomas Glen⁶,Otto Bernd⁷,Töpper Michael⁸,Fritzsch Thomas⁸,Ehrmann Oswin⁹

Affiliation:

1. Apple Inc.

2. GE Global Research, Niskayuna, NY

3. Department of Electrical Engineering, Stanford University, Stanford, CA

4. Tessera Inc., San Jose, CA

5. GE Global Res., Niskayuna, NY, USA

6. Endicott Interconnect, Endicott, NY

7. Pac Tech USA Inc., Santa Clara, CA

8. Fraunhofer IZM, Berlin, Germany

9. Technical University of Berlin, Berlin, Germany

Publisher

Institute of Electrical and Electronics Engineers (IEEE)