Fabricating capacitive micromachined ultrasonic transducers with a novel silicon-nitride-Based wafer bonding process-Reference-Cited by-同舟云学术

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Fabricating capacitive micromachined ultrasonic transducers with a novel silicon-nitride-Based wafer bonding process

Published:2009-05 Issue:5 Volume:56 Page:1074-1084
ISSN:0885-3010
Container-title:IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control
language:
Short-container-title:IEEE Trans. Ultrason., Ferroelect., Freq. Contr.

Author:

Logan A.,Yeow J.T.W.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Acoustics and Ultrasonics,Instrumentation

Link

http://xplorestaging.ieee.org/ielx5/58/4976266/04976294.pdf?arnumber=4976294

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