Reliability studies μBGA solder joints-effect of Ni-Sn intermetallic compound-Reference-Cited by-同舟云学术

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Reliability studies μBGA solder joints-effect of Ni-Sn intermetallic compound

Published:2001 Issue:1 Volume:24 Page:25-32
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Chan Y.C.,Tu P.L.,Tang C.W.,Hung K.C.,Lai J.K.L.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/19628/00909621.pdf?arnumber=909621

Cited by 46 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of Temperature–Humidity Treatment on Bending Reliability of Epoxy Sn–58Bi Solder with Electroless Nickel Immersion Gold (ENIG) and Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Surface Finishes;Science of Advanced Materials;2020-04-01

2. Stress and reliability analysis for interconnects;Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore;2020

3. Mechanical Reliability of the Epoxy Sn-58wt.%Bi Solder Joints with Different Surface Finishes Under Thermal Shock;Journal of Electronic Materials;2018-04-06

4. Investigation of Stress-Strain Constitutive Behavior of Intermetallic Alloys;Journal of Mechanics;2017-10-02

5. Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test;Journal of Electronic Materials;2016-04-19

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