Author:
Wang Lin Biao,Lee Fook Wai,Chua Wai Kin,Chua Eng Kee
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Computer Networks and Communications,Instrumentation,Signal Processing,Software
Cited by
1 articles.
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1. Solving Automotive Signal Integrity Issues by EMC Simulation;2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME);2021-10-27