Impact of Ground Via Placement and Size in Grounded Coplanar Waveguide Interconnects
Author:
Affiliation:
1. Nanjing Normal University,Jiangsu Key Laboratory of 3D Printing Equipment and Manufacturing
Funder
National Science Foundation
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10593800/10594016/10594302.pdf?arnumber=10594302
Reference7 articles.
1. Effect of Defective Substrate on a Grounded Coplanar Waveguide Antenna
2. Simulation Guidelines for Wideband Ground Backed Coplanar Waveguide Transmission Lines
3. Coplanar Waveguides for MMIC Applications: Effect of Upper Shielding, Conductor Backing, Finite-Extent Ground Planes, and Line-to-Line Coupling
4. Design Considerations for Monolithic Microwave Circuits
5. Transmission characteristics of finite-width conductor-backed coplanar waveguide
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