Low-Temperature Atmospheric-Pressure-Plasma Jet for Thin-Film Deposition-Reference-Cited by-同舟云学术

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Low-Temperature Atmospheric-Pressure-Plasma Jet for Thin-Film Deposition

Published:2009-07 Issue:7 Volume:37 Page:1127-1128
ISSN:0093-3813
Container-title:IEEE Transactions on Plasma Science
language:
Short-container-title:IEEE Trans. Plasma Sci.

Author:

Chun Huang ,Wen-Tung Hsu ,Chi-Hung Liu ,Shin-Yi Wu ,Shih-Hsien Yang ,Tai-Hung Chen ,Ta-Chin Wei

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Condensed Matter Physics,Nuclear and High Energy Physics

Link

http://xplorestaging.ieee.org/ielx5/27/5154038/04768704.pdf?arnumber=4768704

Cited by 29 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Determination of the apparent effective ionization coefficient in mixtures of He and O₂ using steady-state Townsend discharge: effect of penning ionization and attachment;Physica Scripta;2023-03-20

2. Copper film deposition using a helium dielectric barrier discharge jet;Plasma Processes and Polymers;2020-06-15

3. Deposition of SiOx thin films using hexamethyldisiloxane in atmospheric pressure plasma enhanced chemical vapor deposition;Journal of Physics: Conference Series;2020-04-01

4. Cyclonic plasma surface hydrophilization of polysulfone membrane material;Japanese Journal of Applied Physics;2019-11-11

5. Research on the Gas Effect of Octafluorocyclobutane Plasma Jet at Atmospheric Pressure for Silicon Etching;IEEE Transactions on Plasma Science;2019-02

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