Prevention of Al Interconnect Corrosion during Temperature-Humidity-Bias (THB) Stress-Reference-Cited by-同舟云学术

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Prevention of Al Interconnect Corrosion during Temperature-Humidity-Bias (THB) Stress

Published:2023-10-08 Issue: Volume: Page:1-5
ISSN:
Container-title:2023 IEEE International Integrated Reliability Workshop (IIRW)
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Author:

Keyes Michael¹,Perry Mark¹,O’Keeffe Daniel¹,Watanabe Yuichi²,Yamane Akira²,Tanaka Naoaki²,Gambino Jeff³

Affiliation:

1. Cork,Ireland

2. Gunma,Japan

3. Gresham,OR,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10477668/10477631/10477716.pdf?arnumber=10477716

Reference13 articles.

1. Application of SLAT methodology in bond pad process evaluation for sidewall polymer removal

2. Approaches for patterning of aluminum

3. Aluminum Interconnect Cleaning and Drying

4. The Effects of Phosphorus-Doped Passivation Glass on the Corrosion of Aluminum

5. A Paradoxical Relationship between Width/Spacing of Aluminum Electrodes and Aluminum Corrosion

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