A Comprehensive Methodology for Optimizing Power Integrity of High-Performance IC Packages-Reference-Cited by-同舟云学术

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A Comprehensive Methodology for Optimizing Power Integrity of High-Performance IC Packages

Published:2023-10-15 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
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Author:

Liu Wei¹,Chen Guang¹,Ding Qian¹,Jiang Jenny²

Affiliation:

1. Intel Corporation,Programmable Solutions Group Engineering (PSGE),Santa Clara,USA

2. Intel Corporation,Programmable Solutions Group Engineering (PSGE),Orgeon,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10314857/10314859/10314865.pdf?arnumber=10314865

Reference7 articles.

1. DC IR-Drop Analysis of Multilayered Power Distribution Network by Discontinuous Galerkin Method With Thermal Effects Incorporated

2. A Novel System-Level Power Integrity Transient Analysis Methodology using Simplified CPM Model, Physics-based Equivalent Circuit PDN Model and Small Signal VRM Model

3. Die Embedding Challenges for EMIB Advanced Packaging Technology

4. Power distribution system design methodology and capacitor selection for modern CMOS technology

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Signal, Power and Thermal Co-optimization Methodology for FPGA Advanced Package;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

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