Full-Wave Analysis of Interconnects in Finite Substrates with Layered Media Formulation of SVS-EFIE for 3D Composite Metal-Dielectric Structures
Author:
Affiliation:
1. University of Manitoba,Dept. of ECE,Winnipeg,Canada
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10314857/10314859/10314891.pdf?arnumber=10314891
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1. Packaging Benchmark Suite;IEEE EPS Technical Committee on Electrical Design Modeling and Simulation,2021
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