Radiated Fields by Vias and Matched Microstrip Traces in High Speed PCBs
Author:
Affiliation:
1. Politehnica University,Department of Telecommunications,Bucharest,Romania
2. Military Technical Academy “Ferdinand I”,Department of Communications and Information Technology,Bucharest,Romania
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9817096/9817149/09817166.pdf?arnumber=9817166
Reference9 articles.
1. Future needs in EMC of ICs: Are you hearing the voice of Industry;sicard;EMC Compo 2015 Edinburgh,2015
2. Recent advances in electromagnetic compatibility of 3D-ICs &2013; Part I
3. Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
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