Modeling and experimental studies on thermosonic flip-chip bonding
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
General Engineering
Link
http://xplorestaging.ieee.org/ielx4/96/10019/00475282.pdf?arnumber=475282
Cited by 32 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Ultrasonic Effects in the Thermosonic Flip Chip Bonding Process;IEEE Transactions on Components, Packaging and Manufacturing Technology;2013-02
2. Sliding Mechanism of Lateral Thermosonic Process With Anisotropic Conductive Film for High Productivity and High Reliability;IEEE Transactions on Components, Packaging and Manufacturing Technology;2013-02
3. Modeling study of thermosonic flip chip bonding process;Microelectronics Reliability;2012-11
4. Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface;IEEE Transactions on Components, Packaging and Manufacturing Technology;2011-06
5. Finite Element Modeling of Simultaneous Ultrasonic Bumping With Au Balls;Journal of Electronic Packaging;2009-10-29
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