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MEMS modular packaging and interfaces

Published:2000 Issue: Volume: Page:
ISSN:
Container-title:2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)
language:
Short-container-title:

Author:

Schuenemann M.¹,Jam K.A.,Grosser V.,Leutenbauer R.,Bauer G.,Schaefer W.,Reichl H.

Affiliation:

1. Fraunhofer Inst. Manuf. Eng. & Autom. IPA, Stuttgart, Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6887/18541/00853232.pdf?arnumber=853232

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Packaging;Reference Module in Materials Science and Materials Engineering;2016

2. Robust 3D Radio Sensor Systems with Embedded Active and Passive Components for Industrial Applications;Communications in Computer and Information Science;2012

3. Introduction to MEMS Packaging;Microsystems and Nanotechnology;2012

4. Low-Cost, Wideband Ultrasonic Transmitter and Receiver for Array Signal Processing Applications;IEEE Sensors Journal;2011-05

5. Packaging and Reliability Issues in Micro-/Nanosystems;Springer Handbook of Nanotechnology;2010

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